Assemblies with modules
KIMT provides packaging solutions for thermoelectric modules, offering both standard and custom-designed options to meet specific application requirements.
KIMT expertly assembles thermoelectric modules into standard metal-glass and metal-ceramic packages, as well as custom-designed packages tailored to specific needs. KIMT welcomes collaboration with customers to co-develop innovative packaging solutions, leveraging our expertise in assembly and integration.
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Packages options
Below are popular headers and packages commonly used for thermoelectrically cooled laser diodes, detectors and sensors within optoelectronic applications.
TO-8
Metal-glass headers for IR, XRF detectors.
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TO-39 (TO-5)
Metal-glass headers for IR detectors.
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TO-46
Metal-glass headers for low-power lasers with thermal stabilization
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TO-66
Metal-glass headers for IR and other detectors with mounting holes.
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TO-37
Metal-glass headers for IR and other detectors with mounting holes
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TO-13
Metal-glass headers for IR and other detectors with mounting holes
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HHL
Package for high power laser diodes
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Butterfly
Metal-ceramic and metal-glass Butterfly type packages for lasers with thermal stabilization
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PS-28
Metal-glass packages for detectors and sensors with a large number of pins
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TOSA
Ceramic metal packages for telecommunication applications
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HTCC & LTCC
Thermally stabilized packages for CCD and CMOS matrix
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