Butterfly

The most common Butterfly configuration is a 14-pin package with a CuW or CuMo base for enhanced heat dissipation. Its interior accommodates a thermoelectric cooler (TEC) up to 9×16 mm. KIMT provides sub-assemblies, consisting of a TEC installed within a Butterfly package, offering cooling capacities up to 25 W (at standard room conditions).

The sub-assemblies are based on KIMT’s ML06, ML07, MDL06 and MD10 TEC series. Manufacturing options include a wide variety of ceramics materials and surface conditions, pinout configurations, thermistors and other optimizations for specific applications.

14 pin BTF with ceramic insulation	14 pin BTF with glass insulation
14 pin BTF with ceramic insulation and optical filter	Customized 40 pin BTF with glass insulation

Key features

• Elongated shape with a metal housing that flares out into two "wings." The central part of the package contains the laser diode or optoelectronic component.
• Integrated Thermal Management: Heat sink and/or TEC for temperature control.
• Hermetic Seal: ensures reliability in harsh environments
• Fiber Coupling: Facilitates easy connection to optical fibers.
• Multiple Leads: For power, signal, thermal control and temperature sensing.
• Ceramic Submount: Provides precise laser diode mounting and additional thermal management.

Applications

• High-Power Laser Diodes: Fiber-optic communication, LiDAR, industrial processing, medical devices.
• Fiber-Optic Systems: Telecommunications, data communications.
• Wavelength-Stabilized Laser Diodes: Spectroscopy, medical diagnostics.
• Environmental Sensors
• Medical Applications (Laser Surgery/Diagnostics): High-power, temperature-stable laser diodes.