Metallized ceramics

KIMT’s patented technology provides a superior method for manufacturing metallized ceramic substrates and ceramic PCBs, outperforming standard thin- and thick-film processes. We offer a full spectrum of services for creating single- and double-sided ceramic PCBs on materials like Al₂O₃ and AlN, known for precision, quality, solderability and metallization adhesion. KIMT’s expertise enables rapid development and production for applications in laser diodes, optoelectronics and RF technology.

Parameter	Dimensions	Units	Comments
Substrate footprint, max	60.0 x 48.0	mm	Other dimensions by request
Substrate thickness	0.15; 0.25; 0.38, 0.5; 0.63; 0.76, 0.89, 1.0	mm	Other dimesnions by request
Substrate surface
- polished	Ra < 0.1	um
- lapped	Ra < 0.4	um
Pattern properties
Stripe width, min	0.1	mm
Between stripes, min	0.07	mm
Metallization adhesion	> 2	kg/mm²
Via-holes diameter, minimum	0.2	mm
Alignment accuracy	20	um	For double-sided patterns
Metallization
Adhesion layer	< 0.1	um
Conductive layer (Сu)	25	um
Barrier layer (Ni)	3	um	Other dimensions by request
Finishing layer (Au)	0.2 - 0.3	um	Other dimensions by request
Processing
Laser	+
Dicing	+